利用快速红外热成像技术研究聚酰亚胺薄膜击穿前的丝状导电

S. Diaham, G. Bélijar, M. Locatelli, T. Lebey
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引用次数: 1

摘要

本文报道了在300°C下检测聚酰亚胺(PI)薄膜中丝状导电过程的视觉实验证据。这是通过快速红外热成像技术与电介质击穿前最后100毫秒的电流-电压测量相结合获得的。而全电极传导过程导致PI的绝对温度升高~40℃,细丝传导过程在短时间内使PI样品达到介电击穿,温度升高更大(~100℃)。这项工作清楚地强调了击穿的热起源,其中PI温度的增加与其热降解是相容的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evidence of filamentary electrical conduction in polyimide films before breakdown using fast infrared thermography
This paper reports a visual experimental evidence of the detection of the filamentary electrical conduction process in a polyimide (PI) film at 300°C. This was obtained using fast infrared thermography technique coupled to current-voltage measurements in the last 100 ms before the dielectric breakdown. While the full-electrode conduction process leads to an increase in the PI absolute temperature of ~40°C, the filamentary conduction process gives rise to a larger increase (~100°C) in a short time bringing the PI sample to the dielectric breakdown. This work highlights clearly the thermal origin of the breakdown where such an increase in PI temperature is compatible with its thermal degradation.
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