采用槽线、板线和屏蔽多层共面波导的新型垂直过渡,用于50 GHz LTCC密封SMT MMIC封装

I. Ju, I. Yom, Seung-hyeup Oh
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引用次数: 3

摘要

为了开发DC至50 GHz频段低损耗LTCC密封表面安装(SMT) MMIC封装,提出了一种采用槽线、板线和屏蔽多层共面波导(SMCPW)的新型垂直过渡方法。采用槽线、板线和smcpw,最大限度地减少了辐射损失、串扰和传统通过垂直过渡的不连续。提出的垂直过渡是由SMCPW1 -槽线-板线-SMCPW2 -SMCPW3组成的多条传输线组成的。所制得的LTCC密封SMT MMIC封装在直流至53 GHz频率范围内的插入损耗小于0.6 dB,反射损耗低于-20 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel vertical transition using a trough line, a slab line and shielded multilayer coplanar waveguides for 50 GHz LTCC hermetic SMT MMIC package
A new vertical transition using a trough line, a slab line and shielded multilayer coplanar waveguides (SMCPW) was proposed in order to develop a DC to 50 GHz band low loss LTCC hermetic surface mounting (SMT) MMIC package. The trough line, the slab line and the SMCPWs were employed to minimize the radiation loss, crosstalk and discontinuity of the conventional via vertical transition. The proposed vertical transition was made with the multiple transmission lines that consist of the SMCPW1 -trough line -slab line -SMCPW2 -SMCPW3. The manufactured LTCC hermetic SMT MMIC package showed the low insertion loss less than 0.6 dB and the reflection loss below -20 dB in the frequency range from DC to 53 GHz.
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