微波固态功率放大器技术

M. Kasal
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引用次数: 1

摘要

本文主要介绍了我国目前在微波,特别是x波段功率放大器技术方面的研究现状。为此,我们考虑了不同的有源器件。不幸的是,我们没有设法获得这些频率的超级现代GaN晶体管(芯片),如TriQuint的TGA2023-05或来自同一生产商的模块,如TGA-2554-GSG。相反,我们使用了来自Eudyna的内部匹配的GaAs fet以及来自Mimix的GaAs模块XP-1006A。随后,我们设计,构建和测试了三个具有不同有源器件的功率放大器,输出功率分别为4,8和20瓦,频率为10 GHz。在本文中,我们将介绍放大器的设计和完成以及测试结果。我们通过在输入和输出处使用90度3db混合耦合器的双级实现了最高功率。在聚四氟乙烯基板上采用微带技术。利用ANSYS建模软件对布局的关键部位进行了优化。直流电路需要按照合适的时序和大的直流电流进行设计。考虑了相应的冷却系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microwave solid state power amplifier technology
This paper is focused on our current research in the field of power amplifier technology for microwaves, especially the X-band. For this purpose we considered different active devices. Unfortunately, we did not manage to obtain super modern GaN transistors (chips) for these frequencies such as TGA2023-05 from TriQuint or module such as TGA-2554-GSG from the same producer. Instead we used internally matched GaAs FETs from Eudyna as well as GaAs module XP-1006A from Mimix. Subsequently we have designed, built and tested three power amplifiers with different active devices and output power of 4, 8 and 20 Watts on 10 GHz. In the paper we would like to introduce design and completion of the amplifiers as well as test results. The highest power we achieved by double stage with 90 degrees 3 dB hybrid couplers at the input and output. The microstrip technique on PTFE substrate has been used. Critical parts of layouts were optimized by using ANSYS modeling software. The dc circuitry needs to be designed according to the proper time sequence and high dc currents. Corresponding cooling system was taken into account.
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