PLAYOUT VLSI设计系统中的芯片组装

Klaus Glasmacher, G. Zimmermann
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引用次数: 5

摘要

PLAYOUT中的芯片组装是为自上而下的芯片规划而设计的。一个三层层次结构的示例演示了新的设计策略。三阶段芯片规划和芯片组装具有密切的相互作用,保证了层级之间约束的交换。芯片组装由两个不同的功能组成:细胞合成和细胞组装。对于细胞合成,采用标准的细胞块布局来演示一种新的策略。与独立生成同一平面图中的块的布局不同,布局是并行进行的,并且在平面图中块的插脚位置、形状和位置等约束是动态交换的。这种方法可以很好地调整单元之间的引脚位置并减小通道宽度。独立于细胞合成策略的是细胞组装,被视为拓扑压实问题,以完善平面图。提出了一种遗传算法来解决这一问题。初步实验结果表明了新策略的优越性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Chip assembly in the PLAYOUT VLSI design system
Chip assembly in PLAYOUT is designed for top-down chip planning. An example of a three-level hierarchy demonstrates the new design strategy. Three-phase chip planning and chip assembly have close interaction to guarantee an exchange of constraints between levels of the hierarchy. Chip assembly is composed of two different functions: cell synthesis, and cell assembly. For cell synthesis, standard cell block layout is used to demonstrate a new strategy. Instead of generating the layouts of blocks in the same floorplan independently, layout proceeds in parallel and constraints like pin positions, shape and position of the blocks in the floorplan are exchanged dynamically. This method results in excellent adjustment of pin positions between cells and reduction of channel widths. Independent of the cell synthesis strategy is cell assembly, viewed as a topological compaction problem to refine the floorplans. A genetic algorithm is shown to solve this problem. Initial experimental results show the advantages of the new strategies.<>
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