电荷平衡SGRSO MOSFET的设计与制造

D. Yan, Liu Xin, He Ming, Zhang Yan Fei, Chen Ze, Gong Xue Qin
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引用次数: 1

摘要

本文介绍了分栅复流阶梯式氧化物(SGRSO) MOSFET的仿真研究和工艺开发。模拟了不同外延电阻率、p体结构、栅极结构和栅极氧化物厚度等条件下的器件。优化了器件的电场分布,纵向电场近似为梯形。击穿电压75V,阈值电压1.8V,质量因数FOM为594 m$\Omega$的MOSFET。获取nC。SGRSO MOSFET是基于IMECAS集成电路中导工艺平台制作的,采用SMD-0.5封装。击穿电压BVDSS为76V,比导通电阻Rdson为0.39m$\Omega$/mm2,而相同电压等级的平面栅极器件为2.36m$\Omega$/mm$^{2}$。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design and fabrication of charge-balanced SGRSO MOSFET
The simulation research and process development of Split-Gate Resurf Stepped Oxide (SGRSO) MOSFET are introduced in this paper. The devices are simulated with different epitaxial resistivity, P-body structures, gate structure and gate oxide thickness, etc. The electric field distribution of the device is optimized, and the longitudinal electric field is approximately trapezoidal. A MOSFET with breakdown voltage of 75V, threshold voltage of 1.8V, quality factor FOM of 5.94m$\Omega$.nC is obtained. The SGRSO MOSFET is fabricated based on the Integrated Circuit Pilot Process Platform of IMECAS, and packaged with SMD-0.5. The breakdown voltage BVDSS is 76V, and the specific on-resistance Rdson is 0.39m$\Omega$/mm2, while the planar gate device of the same voltage level is 2.36m$\Omega$/mm$^{2}$.
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