采用新型液晶聚合物基基片的先进3D封装

C. Ghiu, S. Dalmia, J. Vickers, L. Carastro, W. Czakon, V. Sundaram, G. White
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引用次数: 0

摘要

本文介绍了基于新型多层有机基板的三维封装解决方案的性能。嵌入式射频无源在950 MHz至3 GHz频率范围内的电气性能和-40°c至85°c的稳定性已在有机层压衬底中得到证明。建立在多层液晶聚合物(LCP)基板上的独立高Q电感器可以承受2A的直流电,温度完全在安全范围内。本研究也评估了表面安装ipd的功率处理能力。可靠性测试数据表明多层衬底兼容1次和3次无铅回流焊。一种很有前途的高温LCP材料在260℃下进行3次再流后,电气性能的稳定性得到了显著改善
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates
This paper presents the performance of 3D packaging solutions based on novel multilayered organic substrates. Electrical performance of embedded RF passives over 950 MHz to 3 GHz frequency range and stability from -40degC to 85degC has been demonstrated in an organic laminate substrate. Stand-alone, high Q inductors built on a multilayered liquid crystalline polymer (LCP)-based substrate can withstand a 2A direct current with the temperatures well within the safe range. The power handling capability of surface mounted IPDs is also assessed in this study. Reliability test data demonstrated the multilayer substrate compatibility with 1times and 3times lead free solder reflow. A promising high temperature LCP material enabled a significant improvement in the stability of electrical performance after 3times reflow at 260 degC
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