采用数字间变压器和rc反馈的高平坦度宽带CMOS功率放大器

Ja-Soo Cho, Jaeyong Lee, Changkun Park
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引用次数: 0

摘要

本研究提出了一种支持5G移动通信全带宽的宽带宽、高平坦度的ka波段CMOS功率放大器(PA)。为了获得更宽的带宽,在驱动级和匹配网络中分别采用了rc反馈和数字间变压器技术。此外,在功率级采用了二极管线性化器,以补偿由于确保宽带而导致的输出功率恶化。为了验证所提出的ka波段PA的可行性,我们使用65纳米RFCMOS工艺设计了PA。设计的PA占地0.174 mm2的核心面积。测得的1 dB带宽和增益分别高于12 GHz和13.1 dB。实测饱和功率、P1dB和PAE分别大于12.53 dBm、10.8 dBm和9.18%
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Wide Band CMOS Power Amplifier with High Flatness Using Inter-Digit Transformer and RC-Feedback
In this study, a Ka-band CMOS power amplifier (PA) with wide bandwidth and high flatness to support the full bandwidth of 5G mobile communication was proposed. To obtain wide bandwidth, RC-feedback and inter-digit transformer techniques were applied to the driver stage and matching networks, respectively. In addition, a diode linearizer was applied to the power stage to compensate for the deteriorated output power due to securing wide bandwidth. To verify the feasibility of the proposed Ka-band PA, we designed the PA using a 65-nm RFCMOS process. The designed PA occupies the core area of 0.174 mm2. The measured 1 dB bandwidth and gain were higher than 12 GHz and 13.1 dB, respectively. The measured saturation power, P1dB, and PAE were above 12.53 dBm, 10.8 dBm, and 9.18%, respectively
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