{"title":"毫米波包装","authors":"H. Kuno, T. A. Midford","doi":"10.1109/MWSYM.1992.188299","DOIUrl":null,"url":null,"abstract":"The authors reviewed the state of the art in millimeter-wave packaging and analyzed its potentials and limitations. Based on the analysis of the requirements and technology development, the following trends can be expected for millimeter-wave packages: (1) packaging at higher levels of integration-the advent of millimeter-wave multichip packages; (2) the substantially increased use of electromagnetic simulation design tools; (3) the introduction of new materials and processes, for example AlN and cofired ceramic techniques; (4) the integration of a considerably higher complexity and multiplicity of electronic functions within the package envelope; and (5) a substantial reduction in the size, weight, and cost of millimeter-wave packages.<<ETX>>","PeriodicalId":165665,"journal":{"name":"1992 IEEE Microwave Symposium Digest MTT-S","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Millimeter-wave packaging\",\"authors\":\"H. Kuno, T. A. Midford\",\"doi\":\"10.1109/MWSYM.1992.188299\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors reviewed the state of the art in millimeter-wave packaging and analyzed its potentials and limitations. Based on the analysis of the requirements and technology development, the following trends can be expected for millimeter-wave packages: (1) packaging at higher levels of integration-the advent of millimeter-wave multichip packages; (2) the substantially increased use of electromagnetic simulation design tools; (3) the introduction of new materials and processes, for example AlN and cofired ceramic techniques; (4) the integration of a considerably higher complexity and multiplicity of electronic functions within the package envelope; and (5) a substantial reduction in the size, weight, and cost of millimeter-wave packages.<<ETX>>\",\"PeriodicalId\":165665,\"journal\":{\"name\":\"1992 IEEE Microwave Symposium Digest MTT-S\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1992 IEEE Microwave Symposium Digest MTT-S\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.1992.188299\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 IEEE Microwave Symposium Digest MTT-S","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.1992.188299","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The authors reviewed the state of the art in millimeter-wave packaging and analyzed its potentials and limitations. Based on the analysis of the requirements and technology development, the following trends can be expected for millimeter-wave packages: (1) packaging at higher levels of integration-the advent of millimeter-wave multichip packages; (2) the substantially increased use of electromagnetic simulation design tools; (3) the introduction of new materials and processes, for example AlN and cofired ceramic techniques; (4) the integration of a considerably higher complexity and multiplicity of electronic functions within the package envelope; and (5) a substantial reduction in the size, weight, and cost of millimeter-wave packages.<>
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