低延迟、面积和能效的混合光子等离子体片上互连(HyPPI)

SPIE OPTO Pub Date : 2016-03-15 DOI:10.1117/12.2217284
Shuai Sun, Abdel-Hameed A. Badaway, Vikram K. Narayana, T. El-Ghazawi, V. Sorger
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引用次数: 3

摘要

在本文中,我们对各种互连技术进行了基准测试,包括电、光子和等离子体选择。我们将其与杂化进行了对比,其中我们考虑了用于有源操作设备的等离子体,以及用于无源传播集成电路元件的光子学,并进一步提出了另一种新型混合链路,该链路利用片上激光器进行固有调制,从而绕过电光调制。链路基准测试证明,杂化可以克服纯光子链路和等离子体链路的缺点。我们在各种性能参数,如点对点延迟、能量效率、容量、支持波分复用的能力、串扰耦合长度、比特流密度和能力-延迟-能量-面积比等方面显示出优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low latency, area, and energy efficient Hybrid Photonic Plasmonic on-chip Interconnects (HyPPI)
In this paper we benchmark various interconnect technologies including electrical, photonic, and plasmonic options. We contrast them with hybridizations where we consider plasmonics for active manipulation devices, and photonics for passive propagation integrated circuit elements, and further propose another novel hybrid link that utilizes an on chip laser for intrinsic modulation thus bypassing electro-optic modulation. Link benchmarking proves that hybridization can overcome the shortcomings of both pure photonic and plasmonic links. We show superiority in a variety of performance parameters such as point-to-point latency, energy efficiency, capacity, ability to support wavelength division multiplexing, crosstalk coupling length, bit flow density and Capability-to-Latency-Energy-Area Ratio.
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