一种低成本、低损耗的聚合物波导技术在并行光互连中的应用

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004. Pub Date : 2004-06-28 DOI:10.1109/LEOSST.2004.1338689

R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, G. Bona

{"title":"一种低成本、低损耗的聚合物波导技术在并行光互连中的应用","authors":"R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, G. Bona","doi":"10.1109/LEOSST.2004.1338689","DOIUrl":null,"url":null,"abstract":"We report on the material evaluation, design, fabrication, and characterization of low-loss multimode polymer waveguides that are compatible with standard PCB manufacturing processes for use in large-area high-density high speed optical backplane interconnects.","PeriodicalId":280347,"journal":{"name":"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"53","resultStr":"{\"title\":\"Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications\",\"authors\":\"R. Dangel, U. Bapst, C. Berger, R. Beyeler, L. Dellmann, F. Horst, B. Offrein, G. Bona\",\"doi\":\"10.1109/LEOSST.2004.1338689\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report on the material evaluation, design, fabrication, and characterization of low-loss multimode polymer waveguides that are compatible with standard PCB manufacturing processes for use in large-area high-density high speed optical backplane interconnects.\",\"PeriodicalId\":280347,\"journal\":{\"name\":\"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-06-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"53\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LEOSST.2004.1338689\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOSST.2004.1338689","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 53

摘要

我们报告了低损耗多模聚合物波导的材料评估、设计、制造和特性，这些波导与用于大面积高密度高速光学背板互连的标准PCB制造工艺兼容。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Development of a low-cost low-loss polymer waveguide technology for parallel optical interconnect applications

We report on the material evaluation, design, fabrication, and characterization of low-loss multimode polymer waveguides that are compatible with standard PCB manufacturing processes for use in large-area high-density high speed optical backplane interconnects.

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来源期刊

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.

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