MEMS用多层薄膜的力学性能研究

Proceedings of the Second International Conference on Intelligent Processing and Manufacturing of Materials. IPMM'99 (Cat. No.99EX296) Pub Date : 1999-07-01 DOI:10.1109/IPMM.1999.792477

T. Hirasawa, H. Kotera, S. Tawa, S. Shima

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引用次数: 0

摘要

研究多层薄膜的力学性能对设计和实现微机电系统(MEMS)具有重要意义。提出了一种新的拉伸测试方法来测量用于MEMS的多层薄膜的力学性能。在这种方法中，我们开发了一种预制的测试基板。测量预制测试基板的杨氏模量后，在测试基板上沉积薄膜并进行拉伸试验。薄膜的杨氏模量可以通过减去预制测试基板的杨氏模量的影响来测量。作为一个例子，测量了溅射法制备的钨薄膜的杨氏模量。讨论了用这种方法测量沉积薄膜力学性能的可行性。

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A study of mechanical properties of multi-layered thin films [for MEMS]

It is of great importance to investigate mechanical properties of a multi-layered thin film in designing and realizing micro-electro-mechanical systems (MEMS). A new tensile test method is proposed to measure mechanical properties of a multi-layered thin film, which are used in MEMS. In this method, we develop a prefabricated test substrate of gage portion. After measuring Young's modulus of prefabricated test substrate, a thin film is deposited on the test substrate and tensile test is carried out. Young's modulus of the thin film can be measured by subtracting the effect of Young's modulus of the prefabricated test substrate. As an example, Young's modulus of a tungsten thin film deposited by sputtering is measured. We discuss the viability of this method for measuring the mechanical properties of deposited thin film.

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Proceedings of the Second International Conference on Intelligent Processing and Manufacturing of Materials. IPMM'99 (Cat. No.99EX296)

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