MOS晶体管栅极氧化物击穿对电路性能的影响

T. Yeoh, Shze-Jer Hu
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引用次数: 11

摘要

MOS晶体管栅极氧化物击穿是一种常见的失效机制,需要了解其对电路性能的影响。研究表明,MOS晶体管栅极氧化物击穿后在栅极氧化物中形成磷扩散路径。这种扩散路径来源于掺磷多晶硅栅。通过SPICE仿真研究了p沟道和n沟道栅极氧化物击穿对四逆变器链电路功能的影响。研究发现,p沟道或n沟道晶体管的栅极-漏极氧化物击穿会显著降低电路的整体性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of MOS transistor gate oxide breakdown on circuit performance
MOS transistor gate oxide breakdown is a common failure mechanism which needs to be understood in terms of its impact on circuit performance. Studies have shown that post MOS transistor gate oxide breakdown forms a phosphorous diffusion path in the gate oxide. This diffusion path originates from the phosphorous doped polysilicon gate. The effect of p- and n-channel gate oxide breakdown on the functionality of a four-inverter chain circuit is studied through SPICE simulations. Gate-to-drain oxide breakdown of either p- or n-channel transistors was found to significantly degrade overall circuit performance.
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