3-D存储器的并行数据传输

Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society Pub Date : 1996-11-18 DOI:10.1109/LEOS.1996.565175

S. Esener, F. Mccormick

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引用次数: 0

摘要

在这次演讲中，我们将讨论可能的光电封装技术，这些技术可以为未来的并行读出光学头提供非常需要的紧凑性和轻质性。基于这些技术的特点，我们将讨论在未来十年内容量光盘系统可能实现的数据速率，并讨论其潜在的应用。

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Parallel data transfer from 3-D memories

In this presentation we will discuss possible optoelectronic packaging technologies that can provide the much needed compactness and light weight to future parallel readout optical heads. Based on the characteristics of these technologies we will discuss possible data rates that can be achieved over the next decade by volumetric optical disk systems and discuss their potential applications.

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来源期刊

Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society

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