利用薄膜超导元件的计算机时间平均热性能

H. Sobol
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引用次数: 2

摘要

在预测复杂的低温电子计算机耗散加热的局限性之前,有必要了解低温电子门的静态热特性。进行了一个实验程序来确定隔离门和热耦合门的热性能。本文报道的所有实验都是在蒸发到玻璃基板上的锡栅上进行的。定义了栅极的总热导K,并将K的实验值表示为功率和栅极几何形状的函数。基于温度相关的传热系数,对热流进行了分析。导出了K的理论值和温度分布。该理论定性地预测了温度的变化。最后,对结果进行了外推,以估计在热耦合系统中可以安全使用的低温控管的数量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Time Average Thermal Properties of a Computer Utilizing Thin-Film Superconducting Elements
It is necessary to understand the static thermal properties of cryotron gates before one can predict the limitations associated with dissipative heating of a complex cryotronic computer. An experimental program has been conducted to determine the thermal properties of isolated and of thermally coupled gates. All experiments reported in this paper were performed on tin gates evaporated onto glass substrates. The total thermal conductance K of a gate is defined, and experimental values of K are presented as a function of power and gate geometry. An analysis of the heat flow is given, based on a temperature-dependent coefficient of heat transfer. Theoretical values of K and temperature distribution are derived. The theory qualitatively predicts the temperature variation. Finally, the results are extrapolated to estimate the number of cryotrons that can be used safely in a thermally coupled system.
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