温度对使用GIDL进行写入操作的utbox1t - dram的影响

K. Sasaki, L. Almeida, J. Martino, M. Aoulaiche, E. Simoen, C. Claeys
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引用次数: 11

摘要

本文通过数值模拟研究了温度对超薄埋藏氧化物(UTBOX) FDSOI器件使用GIDL(栅极感应漏极)进行写入操作的1T-DRAM(单晶体管动态随机存取存储器单元)的影响。在较高的温度下,可以观察到,当使用标准读取时,内存窗口会发生变化,并且保留时间会降低。为了解决这个问题,我们建议ZTC读取,它独立于温度固定状态0电流。此外,考虑I0电流作为存储单元操作的参考电流可改善保持时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature influence on UTBOX 1T-DRAM using GIDL for writing operation
This paper investigates the temperature influence on Ultra Thin Buried Oxide (UTBOX) FDSOI devices used as a 1T-DRAM (single transistor dynamic random access memory cell) using GIDL (Gate Induced Drain Leakage) for writing operation through numerical simulations. At higher temperatures, it is observed that the memory window varies and the retention time is degraded, when using a standard read. To solve this issue, we suggest the ZTC read, which fixes the state-0 current independently of the temperature. Moreover, considering I0 current as a reference current for the memory cell operation results in improved retention time.
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