A combined electric/magnetic field surface volume integral equation approach for the fast characterization of microstrip/substrate integrated waveguide structures

In this contribution, a combined electric field/magnetic field surface/volume integral equation approach is presented with special features for the characterization of substrate integrated waveguide (SIW) components. Due to the use of a parallel plate waveguide Green's function, only a small number of volume current basis functions are necessary to model the SIWs. The focal point is set on the specification of microstrip line-SIW transitions using a via and a pad/antipad configuration for the coupling between the microstrip parts and the SIW. An effective S-parameter extraction is used with both microstrip- and special SIW-waveguide ports. The main goal comprises the design of cheap broadband transitions to SIWs with a thick substrate suited for the feeding of a new class of compact endfire SIW-antennas.