新兴材料引起的电力电子学范式变化

S. Sladic, M. De Santis, E. Živić, Wojciech Giemacki
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引用次数: 0

摘要

宽带隙(WBG)半导体材料如碳化硅(SiC)和氮化镓(GaN)的引入使得半导体器件在工作过程中电压、电流和温度的增加成为可能。这意味着包括船舶推进、高压直流输电(HVDC)和可再生能源系统在内的高压应用可以使用晶体管来实现,而不是更传统的晶闸管应用。然而,晶体管的应用并不局限于IGBT晶体管。新材料可以改进平面功率MOSFET技术,从而提高功率变换器的效率。此外,这一改进可以通过将直流电流引入家庭和电力传输,改变20世纪初传统使用的传统交流电力系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Paradigm Changes in Power Electronics Caused by Emerging Materials
The introduction of the wide bandgap (WBG) semiconductor materials such silicon carbide (SiC) and gallium nitride (GaN) enables the increase of voltage, current and temperature during the operation of semiconductor devices. That means that high voltage applications including ship propulsion, high-voltage DC transmission (HVDC) and renewable energy systems could be realized using transistors instead of the more traditional application of thyristors. However, transistor applications are not limited to IGBT transistors. New materials could improve the planar power MOSFET technology enabling the power converter efficiency improvement. Furthermore, this improvement could change the traditional AC power system used traditionally from the beginning of the 20th century by introducing the DC current into households and power transmission.
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