晶圆级薄膜封装组件的协同设计

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765851

J. Zaal, F. Santagata, W. V. van Driel, G.Q. Zhang, J. Creemer, P. Sarro

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引用次数: 0

摘要

越来越多的半导体公司正在研究与MEMS产品相关的项目。这可以通过MEMS的广泛应用领域来解释，一些机械MEMS的例子是:滤波器[1]，振荡器[2,3]，压力传感器[4]，粒子检测[5]，温度计[6]和陀螺仪[7]。

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Co-design of Wafer Level Thin Film Package assembly

An increasing number of semiconductor companies have research programs related to MEMS products. This can be explained by the wide variety of application areas for MEMS, some mechanical MEMS examples are: filters [1], oscillators [2,3], pressure sensors [4], particle detection [5], thermometers [6] and gyroscopes [7].

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来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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