在0.1 /spl mu/m n- mosfet中,漏极和沟道工程对热电子注入和诱导器件退化的影响

R.B. Hulfachor, K.W. Kim, M. Littlejohn, C. Osburn
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引用次数: 1

摘要

为了研究0.1 /spl mu/m n- mosfet在低压条件下的热载子现象,我们使用了一个全面的蒙特卡罗模拟器来比较各种漏极和沟道设计策略下的热电子注入氧化物。蒙特卡罗模拟器的相关特征包括:(1)电子-电子散射,这在电子能量分布中产生高能尾是很重要的;(2)增强粒子统计算法,提供高能尾的细节;(3)泊松方程的耦合二维数值解,每0.1 fs快速重新计算一次,以提供自一致的动态电场分布。此外,我们通过将蒙特卡罗模拟提供的热电子注入分布与经验模型相结合来生成界面状态分布,然后将这些界面状态纳入SPISCES来计算器件特性的诱导变化,从而研究了0.1 /spl mu/m设计中的相对器件可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Monte Carlo study of drain and channel engineering effects on hot electron injection and induced device degradation in 0.1 /spl mu/m n-MOSFETs
To investigate hot carrier phenomena in 0.1 /spl mu/m n-MOSFETs under low-voltage conditions, we employ a comprehensive Monte Carlo simulator to compare hot electron injection into the oxide for a variety of drain and channel design strategies. Pertinent features of the Monte Carlo simulator include: (1) electron-electron scattering, which is significant in producing the high energy tail in the electron energy distribution; (2) an enhanced particle statistics algorithm to provide detail in the high energy tail; and (3) a coupled two-dimensional numerical solution to Poisson's equation that is rapidly recalculated every 0.1 fs to provide a self-consistent, dynamic electric field distribution. In addition, we examine relative device reliability in the variety of 0.1 /spl mu/m designs by first combining hot electron injection distributions provided by Monte Carlo simulations with an empirical model to generate interface state distributions and next incorporating these interface states into SPISCES to calculate induced changes in device characteristics.
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