基于hdl的多标准射频SoC系统设计方法

A. Atac, Zhimiao Chen, Lei Liao, Yifan Wang, M. Schleyer, Ye Zhang, R. Wunderlich, S. Heinen
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引用次数: 2

摘要

多标准SoC包括先进的射频和模拟电路与数字块普遍存在于现代集成电路。然而,捕捉多标准射频SoC复杂性的系统设计和验证方法仍然有限。本文介绍了一种多标准射频SoC的HDL设计方法,它涵盖了从系统设计到电路模型自动提取和系统顶层验证的所有设计层。所提供的基于HDL的设计方法结合了自顶向下和自底向上的设计方法,并通过自动参数提取(APX)工具将电路自动反映到模型中,从而使设计和验证更加接近。系统或块级验证是通过夜间运行自动获得的模型,而不需要额外的测试台或设计人员交互。这样可以在短期内检测功能错误或性能损失。使用所提供的方法,在8个月内设计和制造了多模蓝牙收发器SoC的首次磁带。系统级仿真结果与制作后的测量结果吻合较好。测试SoC采用0.13 μm CMOS工艺制作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An HDL-based system design methodology for multistandard RF SoC's
Multistandard SoC's including advanced RF and analog circuitry with digital blocks are pervasive in modern IC's. However, the system design and verification methodologies that capture the complexity of multistandard RF SoC's are still limited. In this paper, an HDL design methodology is introduced for multistandard RF SoC's, which covers all the design layers from system design, to automatic extraction of the models from circuits and a systematic top level verification. The offered HDL based design methodology combines top down and bottom up design approaches, and brings the design and verification closer by reflecting the circuits to models automatically via an Automatic Parameter Extraction (APX) tool. System or block level verification is obtained with models automatically by overnight runs, without the need for extra test benches or designer interaction. This enables short term detection of functional errors or performance losses. A first time tape out of a multimode Bluetooth transceiver SoC is designed and fabricated in 8 months by using the offered methodology. The accuracy of the system level simulations show a very good match with the measurement results after fabrication. The test SoC is fabricated with 0.13 μm CMOS technology.
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