{"title":"交错共面定向耦合器的cad设计","authors":"X. Kang, T. Deng, P. Kooi, M. Leong","doi":"10.1109/MTTTWA.1997.595131","DOIUrl":null,"url":null,"abstract":"This paper presents a CAD-oriented design procedure for the interdigitated coplanar directional coupler. It is based on interdigitated coupler equations and conformal mapping techniques and takes into account the width difference in the interdigitated structure and the finite thickness of the substrate. Performance measurement of a sample designed and constructed on 0.635 mm thick alumina shows close agreement with the theoretical results.","PeriodicalId":264044,"journal":{"name":"1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest","volume":"119 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"CAD-oriented design of interdigitated coplanar directional coupler\",\"authors\":\"X. Kang, T. Deng, P. Kooi, M. Leong\",\"doi\":\"10.1109/MTTTWA.1997.595131\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a CAD-oriented design procedure for the interdigitated coplanar directional coupler. It is based on interdigitated coupler equations and conformal mapping techniques and takes into account the width difference in the interdigitated structure and the finite thickness of the substrate. Performance measurement of a sample designed and constructed on 0.635 mm thick alumina shows close agreement with the theoretical results.\",\"PeriodicalId\":264044,\"journal\":{\"name\":\"1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest\",\"volume\":\"119 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-02-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MTTTWA.1997.595131\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE MTT-S Symposium on Technologies for Wireless Applications Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MTTTWA.1997.595131","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
CAD-oriented design of interdigitated coplanar directional coupler
This paper presents a CAD-oriented design procedure for the interdigitated coplanar directional coupler. It is based on interdigitated coupler equations and conformal mapping techniques and takes into account the width difference in the interdigitated structure and the finite thickness of the substrate. Performance measurement of a sample designed and constructed on 0.635 mm thick alumina shows close agreement with the theoretical results.