{"title":"用于自动目视检查焊接件的三维传感器","authors":"K. Yoshimura, S. Okamoto","doi":"10.1109/IECON.1989.69693","DOIUrl":null,"url":null,"abstract":"A high-speed three-dimensional (3-D) sensor has been developed for the automatic visual inspection of soldered parts on printed circuit boards. Its advantages over existing techniques include the detection of the 3-D shape of objects with high speed and high accuracy. Using a coded fiber-optic array and a high-speed processing unit for detecting the position of the scanning light spot, the 3-D sensor is capable of obtaining 9-b range data and 7-b brightness data for 1024*1024 points within 0.85 s. An inspection system using the 3-D sensor can precisely detect the shape of solder joints and the locations of parts, and it can judge them to be good or defective.<<ETX>>","PeriodicalId":384081,"journal":{"name":"15th Annual Conference of IEEE Industrial Electronics Society","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A three-dimensional sensor for automatic visual inspection of soldered parts\",\"authors\":\"K. Yoshimura, S. Okamoto\",\"doi\":\"10.1109/IECON.1989.69693\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A high-speed three-dimensional (3-D) sensor has been developed for the automatic visual inspection of soldered parts on printed circuit boards. Its advantages over existing techniques include the detection of the 3-D shape of objects with high speed and high accuracy. Using a coded fiber-optic array and a high-speed processing unit for detecting the position of the scanning light spot, the 3-D sensor is capable of obtaining 9-b range data and 7-b brightness data for 1024*1024 points within 0.85 s. An inspection system using the 3-D sensor can precisely detect the shape of solder joints and the locations of parts, and it can judge them to be good or defective.<<ETX>>\",\"PeriodicalId\":384081,\"journal\":{\"name\":\"15th Annual Conference of IEEE Industrial Electronics Society\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-11-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"15th Annual Conference of IEEE Industrial Electronics Society\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IECON.1989.69693\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"15th Annual Conference of IEEE Industrial Electronics Society","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IECON.1989.69693","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A three-dimensional sensor for automatic visual inspection of soldered parts
A high-speed three-dimensional (3-D) sensor has been developed for the automatic visual inspection of soldered parts on printed circuit boards. Its advantages over existing techniques include the detection of the 3-D shape of objects with high speed and high accuracy. Using a coded fiber-optic array and a high-speed processing unit for detecting the position of the scanning light spot, the 3-D sensor is capable of obtaining 9-b range data and 7-b brightness data for 1024*1024 points within 0.85 s. An inspection system using the 3-D sensor can precisely detect the shape of solder joints and the locations of parts, and it can judge them to be good or defective.<>
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