通信卫星中GaAs MMIC热阻的数值分析与红外扫描测试

C. Kwak, Kiburm Ahn, D. Chang, I. Yom
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引用次数: 0

摘要

用有限元法计算了3ghz功率放大器MMIC的热阻。通过对比有限元分析发现,如果仅用于测量MMIC的热阻,红外扫描测试的载流子应具有较高的导热系数。红外扫描结果表明,FE分析提供的温度分布与实际情况非常接近,但由于分辨率不够,红外扫描无法测量到最大通道温度。结果表明,当栅极长度小于红外扫描仪的分辨率以及栅极有气桥遮挡时,有限元方法比红外扫描测试能提供更真实的MMIC热阻。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Numerical analysis and IR scan test for thermal resistance of GaAs MMIC in a communications satellite
Thermal resistance of a 3 GHz power amplifier MMIC has been calculated with finite element (FE) analyses. Through comparative FE analyses it has been found that a carrier for infrared (IR) scan test should have high thermal conductivity if it is for measuring thermal resistance of an MMIC only. IR scan results showed that the FE analysis provided temperature distribution quite close to the real and, also, that IR scans could not measure the maximum channel temperature because of not enough resolution. Consequently it has been proved that the FE method can provide more realistic thermal resistance of an MMIC than IR scan test when the gate length is smaller than IR scanner's resolution as well as when the gate is screened by an airbridge.
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