H. Enomoto, Hai Duc Nguyen, K. Inoue, S. Sakamoto, T. Okumura, N. Nishiyama, S. Kondo, S. Arai
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Comparison of wafer bonding methods of membrane GaInAsP wired waveguides on Si substrate
SiO2/SiO2 direct wafer bonding and BCB bonding have been compared to realize membrane GalnAsP wired waveguides on Si Substrate. Bonding environment and pressure were essential for BCB bonding and SiO2 direct bonding, respectively.
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