硅mos晶体管控制栅结构与工作可靠性的关系

O. Kulinich, V. Smyntyna, I. Yatsunskiy, M. Glauberman, G. Chemeresyuk
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引用次数: 0

摘要

研究了硅场MOS器件与栅区杂质活化有关的失效机理。结果表明,失效不仅由二氧化硅中的金属间相引起,而且由于金属原子在二氧化硅中的电迁移和活化而导致MOS器件栅区烧坏。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The connection between structure of control gate and operation reliability of silicon MOS-transistor
Mechanisms of failure processes with silicon field MOS devices connected with activation of impurity in the gate area were studied. It is shown that failures arise not only by intermetallic phase in dioxide silicon but also at burning out of the gate areas of MOS devices occurring owing to electromigration and activation of atoms of metal in dioxide volume.
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