O. Kulinich, V. Smyntyna, I. Yatsunskiy, M. Glauberman, G. Chemeresyuk
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The connection between structure of control gate and operation reliability of silicon MOS-transistor
Mechanisms of failure processes with silicon field MOS devices connected with activation of impurity in the gate area were studied. It is shown that failures arise not only by intermetallic phase in dioxide silicon but also at burning out of the gate areas of MOS devices occurring owing to electromigration and activation of atoms of metal in dioxide volume.