一种以Al/sub 0.52/In/sub 0.48/P为势垒层的新型准晶In/sub 0.2/Ga/sub 0.8/As层HEMT

G. Ng, Y. Chan, D. Pavlidis, Y. Kwon, T. Brock, J. Kuo
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引用次数: 2

摘要

利用气源分子束外延技术制备了一种新型假晶AlInP/InGaAs高电子迁移率晶体管(HEMT)。这种新的伪晶HEMT设计提供:(i)比伪晶Al/sub 0.22/Ga/sub 0.78/As/ i具有更大的/spl Delta/E/sub c/,具有相同的通道组成,从而更好的约束,(ii)减少了x -中心相关问题(J. M. Kuo等,1993),以及(iii) GaAs/InGaAs和AlInP之间的高蚀刻选择性,从而由于更好的栅极凹槽控制而改善了阈值电压均匀性。介绍了亚微米门长Al/sub 0.52/In/sub 0.48/P hemt的直流和微波特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A new pseudomorphic In/sub 0.2/Ga/sub 0.8/As layers HEMT using Al/sub 0.52/In/sub 0.48/P as barrier layer
A new pseudomorphic AlInP/InGaAs high electron mobility transistor (HEMT) grown by gas-source molecular-beam epitaxy has been demonstrated. This new pseudomorphic HEMT design offers: (i) a larger /spl Delta/E/sub c/ than pseudomorphic Al/sub 0.22/Ga/sub 0.78/As/I with the same channel composition and thus better confinement, (ii) reduction of DX-center related problems (J. M. Kuo et al., 1993), and (iii) high etching selectivity between GaAs/InGaAs and AlInP and thus improved threshold voltage uniformity due to better gate recess control. The DC and microwave characteristics of submicron gate-length Al/sub 0.52/In/sub 0.48/P HEMTs are presented.<>
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