基于温度和磁力的MRAM误差行为测试

Xin Shi, Fei Wu, Xidong Guan, C. Xie
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引用次数: 3

摘要

磁阻随机存取存储器(MRAM)具有成为未来存储系统通用存储器的潜力。然而,MRAM的稳定性对温度和磁场敏感。为了深入了解温度和磁场如何影响实际MRAM器件Everspin MR4A08BYS35的可靠性特性,我们提出了一个错误行为模型,对两种类型的MRAM错误进行分类。基于我们提出的误差模型,我们在不同温度和磁场下的真实MRAM器件上进行了广泛的实验。结果表明,在正常工作环境下,所测芯片的MRAM寿命是无限的。临界温度为75℃,主要错误类型为读错误。相反,在磁性环境下,写错误比读错误更严重。临界磁场强度为140高斯。这些结果可用于测量单个MRAM存储芯片的制造质量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Error behaviors testing with temperature and magnetism dependency for MRAM
Magnetoresistive random access memory (MRAM) has the potential to become a universal memory for future storage system. However, the stability of MRAM is sensitive to temperature and magnetic field. To obtain a strong understanding about how the temperature and magnetic field impact the reliability characteristics of real MRAM devices, Everspin MR4A08BYS35, we present an error behavior model to categorize two types of MRAM errors. Based on our proposed error model, we conduct extensive experiments on real MRAM devices in different temperatures and magnetic fields. Our results show that MRAM lifetime for the chips we tested is demonstrated infinite under normal operation environment. The critical temperature is 75°C and the dominant error type is read error. In contrast, write error is more seriously than read error in magnetic environment. The critical magnetic field intensity is 140Gauss. These results can be used for measuring the fabrication quality of individual MRAM memory chips.
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