L. Almeida, M. Aoulaiche, K. Sasaki, T. Nicoletti, M. G. C. de Andrade, N. Collaert, E. Simoen, C. Claeys, J. Martino, M. Jurczak
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引用次数: 6

摘要

研究了漏极读偏置对超薄埋藏氧化物(UTBOX)全耗尽绝缘体上硅(FDSOI)器件FB-BRAM性能的影响。仿真结果与实验结果相结合。可以清楚地观察到两个读区。在高漏极电压的读取状态下,发生了冲击电离,与低漏极电压的读取状态相比,这导致了更高的感觉裕度和更短的保持时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison between low and high read bias in FB-RAM on UTBOX FDSOI devices
This paper investigates the drain read bias impact on the FB-BRAM performance of Ultra Thin Buried Oxide (UTBOX) Fully Depleted Silicon On Insulator (FDSOI) devices. Both simulations and experimental results are used. Two read regimes are clearly observed. In the read regime at higher drain voltage, impact ionization is occurring and this result in a higher sense margin and a lower retention time compared to the low drain voltage read regime.
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