TLM模型中的功耗和温度建模

M. Moy, C. Helmstetter, Tayeb Bouhadiba, F. Maraninchi
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引用次数: 12

摘要

有许多技术和工具可以用来估计芯片的功耗和温度图。这些工具可以帮助硬件设计人员在温度限制的情况下开发节能芯片。对于这个任务,应用程序可以被忽略,或者至少被一些高级场景抽象;在这个阶段,实际的嵌入式软件通常还不可用。然而,在硬件定义之后,嵌入式软件仍然可以对功耗产生重大影响;也就是说,同一应用程序的两个实现可以消耗或多或少的功率。此外,确保温度约束的实际软件电源管理器(通常通过动态作用于电压和频率)本身必须经过验证。验证这种电源管理策略需要执行器和传感器的模型,因此需要对功能模型和非功能模型进行闭环仿真。在本文中,我们提出并比较了几种工具来模拟芯片的功率和热行为及其功能。我们探讨了抽象的几个层次,并研究了对分析精度的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling Power Consumption and Temperature in TLM Models
Many techniques and tools exist to estimate the power consumption and the temperature map of a chip. These tools help the hardware designers develop power efficient chips in the presence of temperature constraints. For this task, the application can be ignored or at least abstracted by some high level scenarios; at this stage, the actual embedded software is generally not available yet. However, after the hardware is defined, the embedded software can still have a significant influence on the power consumption; i.e., two implementations of the same application can consume more or less power. Moreover, the actual software power manager ensuring the temperature constraints, usually by acting dynamically on the voltage and frequency, must itself be validated. Validating such power management policy requires a model of both actuators and sensors, hence a closed-loop simulation of the functional model with a non-functional one. In this paper, we present and compare several tools to simulate the power and thermal behavior of a chip together with its functionality. We explore several levels of abstraction and study the impact on the precision of the analysis.
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