用于大型元件回流焊的反应膏

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887556

D. Seehase, H. Huth, Arne Neiser, M. Nowottnick

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引用次数: 0

摘要

为支持回流焊，研制了一种放热反应膏体。这种浆料在回流焊之前应用于与锡膏沉积物相邻的电子组件上。在回流过程中，浆料内部的化学反应以热的形式释放能量。这种热量有助于熔化锡膏库，从而允许在较低的峰值温度下加工大型部件。本文对这种焊点的可靠性进行了分析。另外，还给出了在大型元件的焊接过程中使用反应膏的两个例子。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Reactive paste for reflow soldering of large components

For the energetic support of reflow soldering an exothermic reacting paste has been developed. This paste is applied on electronic assemblies adjacent to solder paste deposits before reflow soldering. During the reflow process a chemical reaction inside the paste is releasing energy in the form of heat. This heat is assisting in melting up the solder paste depots, hence allowing the processing of large components at lower peak temperatures. Such created solder joints are analyzed here towards their reliability. Also two examples of employing the reacting paste to aid in the soldering process of large components are given.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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