{"title":"研究大功率变换器中效率和功率密度的功率半导体器件元参数化","authors":"R. Barrera-Cardenas, T. Isobe, M. Molinas","doi":"10.1109/EPE.2016.7695625","DOIUrl":null,"url":null,"abstract":"This paper presents a meta-parameterised approach for evaluation of power switch modules (PSMs) in high power converters (HPCs). General models and parameters for evaluation of power losses and volume of PSMs are presented. Then, meta-parameterisation is performed for the High Power Semiconductor Devices (HPSDs) that are commonly used in HPCs, considering two types of package, press-pack and module type, and including IGBT, IGCT and IEGT chip technologies. A comparative analysis based on current capability and its dependency with the frequency in voltage source converters is introduced for the considered HPSD technologies. Press-pack IGBT technology shows the higher current capability and power dissipation performance, so it can be good choice for increase the operative frequency in HPCs.","PeriodicalId":119358,"journal":{"name":"2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)","volume":"166 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Meta-parameterisation of power semiconductor devices for studies of efficiency and power density in high power converters\",\"authors\":\"R. Barrera-Cardenas, T. Isobe, M. Molinas\",\"doi\":\"10.1109/EPE.2016.7695625\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a meta-parameterised approach for evaluation of power switch modules (PSMs) in high power converters (HPCs). General models and parameters for evaluation of power losses and volume of PSMs are presented. Then, meta-parameterisation is performed for the High Power Semiconductor Devices (HPSDs) that are commonly used in HPCs, considering two types of package, press-pack and module type, and including IGBT, IGCT and IEGT chip technologies. A comparative analysis based on current capability and its dependency with the frequency in voltage source converters is introduced for the considered HPSD technologies. Press-pack IGBT technology shows the higher current capability and power dissipation performance, so it can be good choice for increase the operative frequency in HPCs.\",\"PeriodicalId\":119358,\"journal\":{\"name\":\"2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)\",\"volume\":\"166 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPE.2016.7695625\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPE.2016.7695625","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Meta-parameterisation of power semiconductor devices for studies of efficiency and power density in high power converters
This paper presents a meta-parameterised approach for evaluation of power switch modules (PSMs) in high power converters (HPCs). General models and parameters for evaluation of power losses and volume of PSMs are presented. Then, meta-parameterisation is performed for the High Power Semiconductor Devices (HPSDs) that are commonly used in HPCs, considering two types of package, press-pack and module type, and including IGBT, IGCT and IEGT chip technologies. A comparative analysis based on current capability and its dependency with the frequency in voltage source converters is introduced for the considered HPSD technologies. Press-pack IGBT technology shows the higher current capability and power dissipation performance, so it can be good choice for increase the operative frequency in HPCs.
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