磁控溅射中等离子体源改善薄膜应力和表面粗糙度

S. S. Thöny, S. Gees, E. Schüngel
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引用次数: 2

摘要

为磁控溅射沉积系统配备一个额外的等离子体源,可以提高表面粗糙度和膜应力,而不受溅射参数的影响。这将在HfO2/SiO2紫外反射镜和氢化非晶硅的例子中显示。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improving film stress and surface roughness by using a plasma source in magnetron sputtering
Equipping a magnetron sputter deposition system with an additional plasma source allows to improve surface roughness and film stress independent of the sputter parameters. This will be shown at the example of a HfO2/SiO2 UV mirror and of hydrogenated amorphous silicon.
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