侧栅高光,低dv/dt噪声,低损耗

M. Shiraishi, T. Furukawa, S. Watanabe, T. Arai, M. Mori
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引用次数: 32

摘要

本文提出了一种结合平面栅极和沟槽栅极栅极结构历史变化的新型侧栅极高导IGBT。侧栅HiGT具有侧壁栅极,侧壁栅极通道区域的对侧覆盖一层厚厚的氧化层,以降低米勒电容(Cres)。另外,侧栅的HiGT没有浮动p层,导致Vge过量超调。所提出的侧栅IGBT的Cres比传统的沟栅IGBT小75%。导通过程中多余的Vge超调被有效抑制,在相同二极管的恢复dv/dt下,Eon + Err可降低34%。此外,侧门hight具有足够坚固的RBSOA和SCSOA。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Side gate HiGT with low dv/dt noise and low loss
This paper presents a novel side gate HiGT (High-conductivity IGBT) that incorporates historical changes of gate structures for planar and trench gate IGBTs. Side gate HiGT has a side-wall gate, and the opposite side of channel region for side-wall gate is covered by a thick oxide layer to reduce Miller capacitance (Cres). In addition, side gate HiGT has no floating p-layer, which causes the excess Vge overshoot. The proposed side gate HiGT has 75% smaller Cres than the conventional trench gate IGBT. The excess Vge overshoot during turn-on is effectively suppressed, and Eon + Err can be reduced by 34% at the same diode's recovery dv/dt. Furthermore, side gate HiGT has sufficiently rugged RBSOA and SCSOA.
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