T. Lacrevaz, G. Houzet, David Auchère, P. Artillan, C. Bermond, B. Blampey, B. Fléchet
{"title":"高速互连网络中绝缘子的快速鲁棒射频表征方法","authors":"T. Lacrevaz, G. Houzet, David Auchère, P. Artillan, C. Bermond, B. Blampey, B. Fléchet","doi":"10.1109/SAPIW.2018.8401670","DOIUrl":null,"url":null,"abstract":"A wide band (1 GHz–67 GHz) characterization method of insulator layers is presented. This method is well suitable for a fast, simple and accurate extraction of permittivity of insulators used in interconnects networks. Concerning losses, reto-simulations must be achieved to extract the loss tangent, due to the fact that the extraction of G/(C.ω) includes extrinsic effects. So both lossless and loss cases will be discussed. This non-destructive method and low-cost method presents strong advantages because no specific device under test, no metallic deposit and no etching are required. Measurements are performed using a coplanar GSG RF microprobe directly set down on the dielectric material to characterize.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"150 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Fast and robust RF characterization method of insulators used in high speed interconnects networks\",\"authors\":\"T. Lacrevaz, G. Houzet, David Auchère, P. Artillan, C. Bermond, B. Blampey, B. Fléchet\",\"doi\":\"10.1109/SAPIW.2018.8401670\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A wide band (1 GHz–67 GHz) characterization method of insulator layers is presented. This method is well suitable for a fast, simple and accurate extraction of permittivity of insulators used in interconnects networks. Concerning losses, reto-simulations must be achieved to extract the loss tangent, due to the fact that the extraction of G/(C.ω) includes extrinsic effects. So both lossless and loss cases will be discussed. This non-destructive method and low-cost method presents strong advantages because no specific device under test, no metallic deposit and no etching are required. Measurements are performed using a coplanar GSG RF microprobe directly set down on the dielectric material to characterize.\",\"PeriodicalId\":423850,\"journal\":{\"name\":\"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)\",\"volume\":\"150 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SAPIW.2018.8401670\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SAPIW.2018.8401670","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fast and robust RF characterization method of insulators used in high speed interconnects networks
A wide band (1 GHz–67 GHz) characterization method of insulator layers is presented. This method is well suitable for a fast, simple and accurate extraction of permittivity of insulators used in interconnects networks. Concerning losses, reto-simulations must be achieved to extract the loss tangent, due to the fact that the extraction of G/(C.ω) includes extrinsic effects. So both lossless and loss cases will be discussed. This non-destructive method and low-cost method presents strong advantages because no specific device under test, no metallic deposit and no etching are required. Measurements are performed using a coplanar GSG RF microprobe directly set down on the dielectric material to characterize.