用ESPI法测定圆板的杨氏模量

Mariana Farías, R. Rodríguez-Vera, J. Rayas
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引用次数: 1

摘要

如今,由于最近MEMS和智能材料的发展,实现精确的无损技术来测量小样本的机械性能已成为一个主要的研究课题,这些材料需要一个安全的表征程序。在这项工作中,我们研究了一种非破坏性的方法来确定铝圆板的杨氏模量。我们的技术基于电子散斑干涉法(ESPI)、机械加载装置和数字处理,可以获得与文献中值一致的样品杨氏模量的精确值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Young's modulus determination of a circular plate by ESPI
Nowadays, the implementation of an accurate non-destructive technique for the measurement of mechanical properties in small samples has become a main subject of interest due to the recent development of MEMS and intelligent materials, which need a safe procedure for their characterization.In this work we study a non-destructive method for determining the Young's modulus of an aluminium circular plate. Our technique is based on Electronic Speckle Pattern Interferometry (ESPI), a mechanical loading setup, and digital processing, which allows to obtain accurate values of Young's modulus for the sample agreeing those values from the literature.
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