Cu-Co颗粒膜和Co/Cu/Co夹层的磁阻

H. Wang, Q. Jin, C. Chu, Yuanhua Shen, Hanfeng Chen, Feiming Li, Q. Bie, M. Lu, H. Zhai
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引用次数: 0

摘要

研究了不同氩气压力下溅射得到的x = 19、27、43和45的Cu1-xCOx颗粒膜的磁性和磁阻测量。随着溅射氩气压力P的增大,剩余力和矫顽力增大,但磁流变比在P = 1.5 Pa左右达到最大值,说明大磁流变比需要合适的Co晶粒尺寸和合适的浓度。对于Co/Cu/Co夹层,随着Cu层厚度的变化,磁流变比出现振荡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Magnetoresistance in Cu-Co granular films and Co/Cu/Co sandwiches
Cu1-xCOx granular films with x equals 19, 27, 43, and 45 achieved by sputtering with different argon gas pressure are studied by the magnetic and magnetoresistance measurement. With the increase of the sputter argon gas pressure P, the remanence and coercive force increases, but the MR ratio has a maximum value around P equals 1.5 Pa, confirming that a proper size of Co grains and a suitable concentration are required for the large MR. And for Co/Cu/Co sandwiches, we found there was an MR ration oscillation as Cu layer thickness was varied.
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