基于折叠平均技术的1.8V 8位500MSPS折叠插值CMOS a /D转换器设计

Dongjin Lee, Jaewon Song, Jongha Shin, Sanghoon Hwang, Minkyu Song, Tad Wysocki
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引用次数: 10

摘要

本文设计了一种1.8 V、8位500 MSPS的CMOS模数转换器(ADC)。所提出的模数转换器的架构是基于具有级联折叠和级联插值结构的折叠模数转换器。介绍了一种采用源退化技术的自线性化前置放大器和一种高性能的折叠平均技术。此外,还提出了一种新型的自动开关编码器。该芯片采用0.18 μ m 1-poly - 5-metal CMOS技术制造。有源芯片面积为0.79 mm2,在1.8 V电源下功耗约200mw。DNL和INL分别在plusmn0.6/plusmn0.6 lsb范围内。SNDR的测量结果为47.05dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of a 1.8V 8-bit 500MSPS folding-interpolation CMOS A/D converter with a folder averaging technique
In this paper, a CMOS analog-to-digital converter (ADC) with an 8-bit 500 MSPS at 1.8 V is designed. The architecture of the proposed ADC is based on a Folding ADC with a cascaded-folding and a cascaded-interpolation structure. A self-linearized preamplifier with source degeneration technique and a folder averaging technique for the high-performance are introduced. Further, a novel auto-switching encoder is also proposed. The chip has been fabricated with 0.18mu m 1-poly 5-metal CMOS technology. The active chip area is 0.79 mm2 and it consumes about 200 mW at 1.8 V power supply. The DNL and INL are within plusmn0.6/plusmn0.6LSB, respectively. The measured result of SNDR is 47.05dB.
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