Proposal for improvement the welding process of the micro- USB connector on the mother board on tablets

The current electrical and electronic products industry have features extremely dynamic and with constant search for improvement in their manufacturing processes, seeking greater efficiency and lower costs. In the manufacturing process of the main board on tablets, in the area of welding technology, there was a problem in the micro USB connector soldering process causing high defect rates. The purpose of this article was to conduct assessment and proposal for improvement in this process. The methods and techniques used were quality tools PDCA cycle, cause and effect diagram and 5W2H. Among these solutions, the choice was to implement pallets of durestone to maintain the alignment of the connector on the reflow soldering oven. The results show a reduction in failure rates from 12.40% to 0.09% in the production line, which avoided the institution generate a total of 24,800 defective boards on the total to be produced. The total cost savings from logistics repair of these boards was approximately 70.002,80. USD