Reiji Miura, Saito Shibata, Masahiro Usui, Atsutake Kosuge, M. Hamada, T. Kuroda
{"title":"一个5.2GHz射频识别芯片非接触式安装在任意90度旋转和面朝向的FPC上","authors":"Reiji Miura, Saito Shibata, Masahiro Usui, Atsutake Kosuge, M. Hamada, T. Kuroda","doi":"10.1109/ASP-DAC52403.2022.9712597","DOIUrl":null,"url":null,"abstract":"This paper presents an RFID Chip contactlessly mountable on an FPC having an antenna pattern. Inductive coupling between the FPC and the chip realizes low-cost bonding-less implementation. It is also possible to place the chip on the FPC at any angle of 0/90/180/270 degrees and face-up or face-down. Simulation shows the antenna gain is almost the same irrespective of the chip placement angle and face orientation. The experimental results confirmed that the proposed RFID chip works at upto 20cm away from a reader whose output power is 15dBm, achieving the same figure-of-merit as a conventionally bonded module.","PeriodicalId":239260,"journal":{"name":"2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A 5.2GHz RFID Chip Contactlessly Mountable on FPC at any 90-Degree Rotation and Face Orientation\",\"authors\":\"Reiji Miura, Saito Shibata, Masahiro Usui, Atsutake Kosuge, M. Hamada, T. Kuroda\",\"doi\":\"10.1109/ASP-DAC52403.2022.9712597\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an RFID Chip contactlessly mountable on an FPC having an antenna pattern. Inductive coupling between the FPC and the chip realizes low-cost bonding-less implementation. It is also possible to place the chip on the FPC at any angle of 0/90/180/270 degrees and face-up or face-down. Simulation shows the antenna gain is almost the same irrespective of the chip placement angle and face orientation. The experimental results confirmed that the proposed RFID chip works at upto 20cm away from a reader whose output power is 15dBm, achieving the same figure-of-merit as a conventionally bonded module.\",\"PeriodicalId\":239260,\"journal\":{\"name\":\"2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-01-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASP-DAC52403.2022.9712597\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASP-DAC52403.2022.9712597","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 5.2GHz RFID Chip Contactlessly Mountable on FPC at any 90-Degree Rotation and Face Orientation
This paper presents an RFID Chip contactlessly mountable on an FPC having an antenna pattern. Inductive coupling between the FPC and the chip realizes low-cost bonding-less implementation. It is also possible to place the chip on the FPC at any angle of 0/90/180/270 degrees and face-up or face-down. Simulation shows the antenna gain is almost the same irrespective of the chip placement angle and face orientation. The experimental results confirmed that the proposed RFID chip works at upto 20cm away from a reader whose output power is 15dBm, achieving the same figure-of-merit as a conventionally bonded module.