脉冲电子沉积法在Si(001)衬底上制备BiFeO3外延薄膜

Renan M C Ávila, Roney C da Silva, Rogério J Prado
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引用次数: 0

摘要

为了实现外延薄膜的沉积,有必要使用适当取向的衬底,有或没有缓冲层,匹配我们想要生长的外延薄膜的晶格参数。本文报道了利用脉冲电子沉积(PED)技术在Si(001)衬底上沉积外延Bi2SiO5(200)和BiFeO3(001)薄膜,而无需特别制备衬底。在单目标沉积过程中,将外延BSO(200)和T-BFO(001)直接沉积在Si(001)衬底上是相关的,并且在降低成本、提高实用性、界面质量和BFO与Si(001)衬底集成效率方面具有巨大的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preparation of epitaxial BiFeO3 thin films on Si(001) substrates by pulsed electron deposition
To achieve the epitaxial thin films deposition, it is necessary to use properly oriented substrates, with or without buffer layers, matching the lattice parameters of the epitaxial thin film we want to grow. In this work, the deposition of epitaxial Bi2SiO5(200) and BiFeO3(001) thin films on Si(001) substrates by pulsed electron deposition (PED) technique is reported without special substrate preparation. The deposition of epitaxial BSO(200) and T-BFO(001) directly onto Si(001) substrates during a single target deposition process is relevant and presents enormous potential to reduce costs and improve practicality, interface quality and BFO integration efficiency with Si(001) substrates.
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