大电流脉冲对集成电路金属化可靠性的影响

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 Pub Date : 1988-05-11 DOI:10.1109/ITHERM.1988.28668

B. Liew, N. Cheung, C. Hu

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引用次数: 7

摘要

采用二维有限元法进行瞬态热流分析，计算了钝化和未钝化硅衬底上铝线的温升。研究结果用于预测脉冲电流应力下自加热对铝互连材料电迁移寿命的影响。建立了一个模型来考虑损伤松弛和自热效应对电迁移的影响。结果表明，当峰值电流密度(J/sub p/)小于4*10/sup 6/ A/cm/sup 2/时，在典型的加速测试条件下，自加热产生的误差小于20%。基于保持平均电流密度(J/sub av/)恒定的设计规则是可以接受的，只要占空因数大于1%，所有频率高于1mhz。

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Effects of high current pulses on integrated circuit metallization reliability

Transient heat flow analysis using two-dimensional finite-element method has been used to calculate the temperature rise of aluminum lines on passivated and unpassivated silicon substrates. The results are used to predict the effect of self-heating on the electromigration lifetime of aluminum interconnects under pulse current stressing. A model has been developed to incorporate damage relaxation and self-heating effects on electromigration. It is shown that self-heating is expected to produce less than 20% error in typical accelerated testing conditions provided the peak current density (J/sub p/) is less than 4*10/sup 6/ A/cm/sup 2/. Design rules based on keeping the average current density (J/sub av/) constant are acceptable provided that duty factor is larger than 1% for all frequencies above 1 MHz.<>

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InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88

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