用于先进CMOS技术的栅极优先高k/金属栅极堆栈

Y. Nara, N. Mise, M. Kadoshima, T. Morooka, S. Kamiyama, T. Matsuki, M. Sato, T. Ono, T. Aoyama, T. Eimori, Y. Ohji
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引用次数: 2

摘要

提出了金属栅/双高k CMOS集成的实用和可制造的解决方案。为了克服金属栅极/高k栅极堆叠的阈值电压控制困难,特别是栅极优先集成,目前已经提出了几种材料设计。这些包括不同的金属栅极材料和不同的高k材料,分别用于nMOS和pMOS晶体管。这些方法有时会带来复杂的CMOS集成方案。因此,在本文中,我们将给出简单的金属栅极/双高k CMOS制造工艺,具有低阈值电压,适用于规模化CMOS器件制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Gate-first high-k/metal gate stack for advanced CMOS technology
Practical and manufacturable solutions for metal gate/dual high-k CMOS integration are presented. In order to overcome the difficulties of threshold voltage control of metal gate/high-k gate stack especially for gate-first integration, several material designs have been proposed so far. These include different metal gate materials and different high-k materials which are separately used in nMOS and pMOS transistors. These approaches sometimes bring about complicated CMOS integration scheme. In this paper, therefore, we will give simple metal gate/dual high-k CMOS fabrication processes with low threshold voltages which are suitable for scaled CMOS device manufacturing.
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