S. Neermann, J. Franke, M. Sippel, K. Lomakin, G. Gold
{"title":"印刷微波电子器件的可靠性","authors":"S. Neermann, J. Franke, M. Sippel, K. Lomakin, G. Gold","doi":"10.1109/ECTC32696.2021.00283","DOIUrl":null,"url":null,"abstract":"In recent years, the focus of research and industry in the field of printed electronics has been primarily on challenges relating to process improvements like resolution and process stability or material improvements. In contrast, environmental simulation on-tests such as temperature shock tests or humidity-heat tests and their effects on electrical and mechanical properties as well as the high frequency (HF) properties of printed structures have hardly been considered so far. However, such environmental requirements for electronic components are particularly important for reliable use in all areas of printed electronics. In this paper, environmental simulation tests on printed conductive structures were therefore carried out and their effects on the electrical conductivity and microwave frequency properties were measured, analyzed and evaluated. The common environmental simulation test methods as well as their purpose and implementation variants are examined in detail for this purpose. Based on these fundamentals, first of all the selected substrate material RO4350B is printed with a conductive silver paste according to microwave frequency technical specifications using a dispensing printing process and sintered according to the manufacturers specifications. The substrate material has a relative permittivity $\\varepsilon_{r}=3.48$ on which the geometry of the additively produced structures depends. To achieve the required characteristic impedance $Z_{L}\\approx 50\\ \\Omega$, a width of $1080\\ \\mu\\mathrm{m}$ must be reached. The printed samples are then subjected to various environmental simulation tests and examined using various measurement procedures. For the long-term reliability tests, the temperature shock test between −40°C and 140 °C for 1000 cycles, the humidity-heat test with 85°C and 85% relative humidity for 1000 h and the vibration test were selected according to DIN EN 60068. The evaluation methods are to focus on the effects of the environmental simulation tests on electrical and mechanical properties as well as the influence on the high-frequency properties. The conductivity is measured by means of four-wire measurement. A comparison was made of the electrical conductivity in the sintered state, during the reliability tests and at the end of the tests. The samples in the thermal shock test were examined after 250 cycles, 500 cycles, 750 cycles and 1000 cycles to make premature failures of the samples visible. In the moisture-heat test the samples were taken and examined after 500 h and 1000 h. The detection of defects and cracks is carried out using optical control. To determine the high-frequency characteristics, a 2-port measurement of the S-parameters up to 12 GHz was performed. The insertion loss without impact from the transitions was determined using a multi-line method. It can be summarized that the reliability tests have no significant influence on the insertion loss of the printed samples compared to the sintered references. While, especially in the temperature shock test, a change in electrical conductivity and isolated crack formations can be measured. This change regarding conductivity is due to the post-sintering effect caused by temperature exposure during reliability studies and suggests that the sintering time and method recommended by the manufacturer must be adjusted.","PeriodicalId":351817,"journal":{"name":"2021 IEEE 71st Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Reliability of Printed Microwave Electronics\",\"authors\":\"S. Neermann, J. Franke, M. Sippel, K. Lomakin, G. Gold\",\"doi\":\"10.1109/ECTC32696.2021.00283\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In recent years, the focus of research and industry in the field of printed electronics has been primarily on challenges relating to process improvements like resolution and process stability or material improvements. In contrast, environmental simulation on-tests such as temperature shock tests or humidity-heat tests and their effects on electrical and mechanical properties as well as the high frequency (HF) properties of printed structures have hardly been considered so far. However, such environmental requirements for electronic components are particularly important for reliable use in all areas of printed electronics. In this paper, environmental simulation tests on printed conductive structures were therefore carried out and their effects on the electrical conductivity and microwave frequency properties were measured, analyzed and evaluated. The common environmental simulation test methods as well as their purpose and implementation variants are examined in detail for this purpose. Based on these fundamentals, first of all the selected substrate material RO4350B is printed with a conductive silver paste according to microwave frequency technical specifications using a dispensing printing process and sintered according to the manufacturers specifications. The substrate material has a relative permittivity $\\\\varepsilon_{r}=3.48$ on which the geometry of the additively produced structures depends. To achieve the required characteristic impedance $Z_{L}\\\\approx 50\\\\ \\\\Omega$, a width of $1080\\\\ \\\\mu\\\\mathrm{m}$ must be reached. The printed samples are then subjected to various environmental simulation tests and examined using various measurement procedures. For the long-term reliability tests, the temperature shock test between −40°C and 140 °C for 1000 cycles, the humidity-heat test with 85°C and 85% relative humidity for 1000 h and the vibration test were selected according to DIN EN 60068. The evaluation methods are to focus on the effects of the environmental simulation tests on electrical and mechanical properties as well as the influence on the high-frequency properties. The conductivity is measured by means of four-wire measurement. A comparison was made of the electrical conductivity in the sintered state, during the reliability tests and at the end of the tests. The samples in the thermal shock test were examined after 250 cycles, 500 cycles, 750 cycles and 1000 cycles to make premature failures of the samples visible. In the moisture-heat test the samples were taken and examined after 500 h and 1000 h. The detection of defects and cracks is carried out using optical control. To determine the high-frequency characteristics, a 2-port measurement of the S-parameters up to 12 GHz was performed. The insertion loss without impact from the transitions was determined using a multi-line method. It can be summarized that the reliability tests have no significant influence on the insertion loss of the printed samples compared to the sintered references. While, especially in the temperature shock test, a change in electrical conductivity and isolated crack formations can be measured. 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引用次数: 1
摘要
近年来,印刷电子领域的研究和工业重点主要集中在与分辨率和工艺稳定性或材料改进等工艺改进有关的挑战上。相比之下,环境模拟试验,如温度冲击试验或湿热试验,以及它们对印刷结构的电气和机械性能以及高频(HF)性能的影响迄今几乎没有考虑。然而,这种对电子元件的环境要求对于在印刷电子的所有领域中可靠使用尤为重要。因此,本文对印刷导电结构进行了环境模拟试验,并对其电导率和微波频率性能的影响进行了测量、分析和评价。为此,详细研究了常见的环境模拟测试方法及其目的和实现变体。基于这些基本原理,首先选用基板材料ro450b,根据微波频率技术规范,采用点胶印刷工艺,用导电银浆进行印刷,并按照厂家规格进行烧结。所述衬底材料具有相对介电常数$\varepsilon_{r}=3.48$,所述增材制造的结构的几何形状取决于该介电常数。为了达到所需的特性阻抗$Z_{L}\approx 50\ \Omega$,必须达到$1080\ \mu\mathrm{m}$的宽度。然后将打印的样品进行各种环境模拟测试,并使用各种测量程序进行检查。对于长期可靠性试验,温度冲击试验在−40℃~ 140℃之间进行1000次循环,湿热试验在85℃~ 85℃之间进行% relative humidity for 1000 h and the vibration test were selected according to DIN EN 60068. The evaluation methods are to focus on the effects of the environmental simulation tests on electrical and mechanical properties as well as the influence on the high-frequency properties. The conductivity is measured by means of four-wire measurement. A comparison was made of the electrical conductivity in the sintered state, during the reliability tests and at the end of the tests. The samples in the thermal shock test were examined after 250 cycles, 500 cycles, 750 cycles and 1000 cycles to make premature failures of the samples visible. In the moisture-heat test the samples were taken and examined after 500 h and 1000 h. The detection of defects and cracks is carried out using optical control. To determine the high-frequency characteristics, a 2-port measurement of the S-parameters up to 12 GHz was performed. The insertion loss without impact from the transitions was determined using a multi-line method. It can be summarized that the reliability tests have no significant influence on the insertion loss of the printed samples compared to the sintered references. While, especially in the temperature shock test, a change in electrical conductivity and isolated crack formations can be measured. This change regarding conductivity is due to the post-sintering effect caused by temperature exposure during reliability studies and suggests that the sintering time and method recommended by the manufacturer must be adjusted.
In recent years, the focus of research and industry in the field of printed electronics has been primarily on challenges relating to process improvements like resolution and process stability or material improvements. In contrast, environmental simulation on-tests such as temperature shock tests or humidity-heat tests and their effects on electrical and mechanical properties as well as the high frequency (HF) properties of printed structures have hardly been considered so far. However, such environmental requirements for electronic components are particularly important for reliable use in all areas of printed electronics. In this paper, environmental simulation tests on printed conductive structures were therefore carried out and their effects on the electrical conductivity and microwave frequency properties were measured, analyzed and evaluated. The common environmental simulation test methods as well as their purpose and implementation variants are examined in detail for this purpose. Based on these fundamentals, first of all the selected substrate material RO4350B is printed with a conductive silver paste according to microwave frequency technical specifications using a dispensing printing process and sintered according to the manufacturers specifications. The substrate material has a relative permittivity $\varepsilon_{r}=3.48$ on which the geometry of the additively produced structures depends. To achieve the required characteristic impedance $Z_{L}\approx 50\ \Omega$, a width of $1080\ \mu\mathrm{m}$ must be reached. The printed samples are then subjected to various environmental simulation tests and examined using various measurement procedures. For the long-term reliability tests, the temperature shock test between −40°C and 140 °C for 1000 cycles, the humidity-heat test with 85°C and 85% relative humidity for 1000 h and the vibration test were selected according to DIN EN 60068. The evaluation methods are to focus on the effects of the environmental simulation tests on electrical and mechanical properties as well as the influence on the high-frequency properties. The conductivity is measured by means of four-wire measurement. A comparison was made of the electrical conductivity in the sintered state, during the reliability tests and at the end of the tests. The samples in the thermal shock test were examined after 250 cycles, 500 cycles, 750 cycles and 1000 cycles to make premature failures of the samples visible. In the moisture-heat test the samples were taken and examined after 500 h and 1000 h. The detection of defects and cracks is carried out using optical control. To determine the high-frequency characteristics, a 2-port measurement of the S-parameters up to 12 GHz was performed. The insertion loss without impact from the transitions was determined using a multi-line method. It can be summarized that the reliability tests have no significant influence on the insertion loss of the printed samples compared to the sintered references. While, especially in the temperature shock test, a change in electrical conductivity and isolated crack formations can be measured. This change regarding conductivity is due to the post-sintering effect caused by temperature exposure during reliability studies and suggests that the sintering time and method recommended by the manufacturer must be adjusted.