N. Shrestha, Yueh-Chin Lin, Han-Tung Chang, Yiming Li, E. Chang
{"title":"p - inaln栅极AlGaN/GaN高电子迁移率晶体管器件仿真","authors":"N. Shrestha, Yueh-Chin Lin, Han-Tung Chang, Yiming Li, E. Chang","doi":"10.1109/IWCE.2014.6865876","DOIUrl":null,"url":null,"abstract":"Enhancement mode AlGaN/GaN high electron mobility transistor with p-InAlN gate is designed and successfully studied its electrical properties. Threshold voltage of the device is 1.9 V, which is required magnitude of threshold voltage for real device. Similarly, the maximum drain current is 520 mA/mm and trasconductance is 183 mS/mm, which is the record estimation for enhancement-mode (e-mode) device with recorded threshold voltage. P-InAlN layer injects hole to the barrier at higher gate voltage and results in comparatively larger drain current. Selective area etching and re-grow AlInN causes thin barrier layer beneath the gate. This recess like p-InAlN structure can reduce the concentration of 2DEG; and thus results the high magnitude of threshold voltage.","PeriodicalId":168149,"journal":{"name":"2014 International Workshop on Computational Electronics (IWCE)","volume":"205 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Device Simulation of P-InAlN-Gate AlGaN/GaN high electron mobility transistor\",\"authors\":\"N. Shrestha, Yueh-Chin Lin, Han-Tung Chang, Yiming Li, E. Chang\",\"doi\":\"10.1109/IWCE.2014.6865876\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Enhancement mode AlGaN/GaN high electron mobility transistor with p-InAlN gate is designed and successfully studied its electrical properties. Threshold voltage of the device is 1.9 V, which is required magnitude of threshold voltage for real device. Similarly, the maximum drain current is 520 mA/mm and trasconductance is 183 mS/mm, which is the record estimation for enhancement-mode (e-mode) device with recorded threshold voltage. P-InAlN layer injects hole to the barrier at higher gate voltage and results in comparatively larger drain current. Selective area etching and re-grow AlInN causes thin barrier layer beneath the gate. This recess like p-InAlN structure can reduce the concentration of 2DEG; and thus results the high magnitude of threshold voltage.\",\"PeriodicalId\":168149,\"journal\":{\"name\":\"2014 International Workshop on Computational Electronics (IWCE)\",\"volume\":\"205 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-06-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 International Workshop on Computational Electronics (IWCE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWCE.2014.6865876\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Workshop on Computational Electronics (IWCE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWCE.2014.6865876","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Device Simulation of P-InAlN-Gate AlGaN/GaN high electron mobility transistor
Enhancement mode AlGaN/GaN high electron mobility transistor with p-InAlN gate is designed and successfully studied its electrical properties. Threshold voltage of the device is 1.9 V, which is required magnitude of threshold voltage for real device. Similarly, the maximum drain current is 520 mA/mm and trasconductance is 183 mS/mm, which is the record estimation for enhancement-mode (e-mode) device with recorded threshold voltage. P-InAlN layer injects hole to the barrier at higher gate voltage and results in comparatively larger drain current. Selective area etching and re-grow AlInN causes thin barrier layer beneath the gate. This recess like p-InAlN structure can reduce the concentration of 2DEG; and thus results the high magnitude of threshold voltage.