Fully-hybrid computer-aided RF LNA design and evaluation for GSM-1900 standard band

A fully hybrid computer-aided circuit design to achieve a first-pass on-board CMOS LNA fabrication is studied. The LNA is implemented in 0.13-μm CMOS process. A post-layout die-level electromagnetic-field analysis, to extract the interconnection and interaction parasitic between on-chip components, is used. The extracted touchstone model is integrated with circuit model of board including the microstrip lines and surface-mounted passive elements as well as the electromagnetic-field extracted model of radio-frequency coaxial connectors. The hybrid electromagnetic-circuit simulation results are compared with the measurement results for evaluation. The comparison presented an excellent correlation between the simulated and measured results. The connector's effects can be de-embedded using its developed electromagnetic model. This method of simulation and optimization is targeted to achieve first-pass run instead of optimization using costly prototypes.