电子隧穿光谱评价金属- bi2te3接触

J. Nagao, E. Hatta, K. Mukasa
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引用次数: 7

摘要

了解金属电极-半导体结的状态对提高热电器件的性能具有重要意义。隧道光谱已被应用于金属-半导体肖特基结的评价。在本研究中,隧道光谱应用于了解金属/Bi/sub 2/Te/sub 3/或金属/Bi/sub 2/Se/sub 3/结的状态。采用Bridgman法制备了Bi/sub 2/Te/sub 3/单晶和Bi/sub 2/Se/sub 3/单晶。采用10/sup -3/ Pa真空热蒸发的方法,在Bi/sub 2/Te/sub 3/或Bi/sub 2/Se/sub 3/的解理表面形成金属触点。在4.2 K下测量所有隧道电导。Mg/、Al/和Ag/Bi/sub 2/Te/sub 3/结呈现出v型隧道电导曲线,表明这些接点处于肖特基势垒中。Au/Bi/sub 2/Te/sub 3/结显示出平坦的电导特性,因此我们期望在该结中形成欧姆接触。结果表明,在Mg/、Al/或Ag/-Bi/sub 2/Te/sub 3/结上形成了肖特基势垒。在Au/或Al/Bi/sub 2/Se/sub 3/的情况下也形成肖特基势垒。由于Bi/sub 2/Te/sub 3/和Bi/sub 2/Se/sub 3/是窄能隙半导体,它们与这些金属形成肖特基势垒,因此金属-半导体接触特性的表征对提高热电器件的性能具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of metal-Bi2Te3 contacts by electron tunneling spectroscopy
Understanding the states of the metal electrode-semiconductor junctions is important for improving the performance of the thermoelectric devices. Tunneling spectroscopy has been applied to the evaluation of metal-semiconductor Schottky junctions. In this study, tunneling spectroscopy is applied to understanding the states of a metal/Bi/sub 2/Te/sub 3/ or a metal/Bi/sub 2/Se/sub 3/ junction. Bi/sub 2/Te/sub 3/ and Bi/sub 2/Se/sub 3/ single crystals were prepared by Bridgman method. The metal contacts were made on the cleavage surface of Bi/sub 2/Te/sub 3/ or Bi/sub 2/Se/sub 3/ by the thermal evaporation in the vacuum of 10/sup -3/ Pa. All tunnel conductance were measured at 4.2 K. Mg/, Al/ and Ag/Bi/sub 2/Te/sub 3/ junctions exhibit V-shaped tunnel conductance curves which indicate that these contacts ate the Schottky barrier. A Au/Bi/sub 2/Te/sub 3/ junction shows a flat conductance characteristic, so that we expect to be an ohmic contact formed in this junction. It becomes clear that the Schottky barrier is formed on the Mg/, Al/, or Ag/-Bi/sub 2/Te/sub 3/ junction. In the case of Au/ or Al/Bi/sub 2/Se/sub 3/ is also formed the Schottky barrier. Since Bi/sub 2/Te/sub 3/ and Bi/sub 2/Se/sub 3/, which are narrow energy gap semiconductors, form the Schottky barriers with those metals, the characterization of metal-semiconductor contacts is important to improve the performance of thermoelectric devices.
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