不同CMOS技术的静态和动态能量损耗与温度的关系

Piotr Kocanda, A. Kos
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引用次数: 5

摘要

本文的目的是对电源电压和温度下的能量耗散进行分析。所有模拟的基础是来自6种不同CMOS技术(从180nm到14nm)的12个不同的晶体管。在不同电源电压的温度范围内,对栅极从一种状态切换到另一种状态的动态能量进行了评估。为了保证控制信号的真实时序,设计了专用的测试电路。动态能量的变化,作为温度的函数,与电源电压无关,适用于-0.5-7.3%的范围。由于存在泄漏电流,静态功耗随温度升高而升高。当温度从20°C上升到100°C时,静电倍率至少为3倍至85倍。低活度运行时,静态能耗对总能耗的影响较大。在大多数情况下,人们不能忽视温度对能源消耗的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Static and dynamic energy losses vs. temperature in different CMOS technologies
The aim of this paper is energy dissipation analysis in regards to supply voltage and temperature. The basis of all simulations are 12 different transistors coming from 6 different CMOS technologies (from 180nm to 14nm). Dynamic energy used to switch a gate from one state to the other was evaluated in a range of temperature for different supply voltages. In order to guarantee a realistic timing of control signals a special testing circuit was designed. Change of dynamic energy, as a function of temperature, regardless of supply voltage fits in range of -0.5-7.3%. Static power dissipation, a result of existing leakage currents, rises with temperature. When temperature rises from 20 to 100°C static power multiplicities at least 3 times up to 85 times. When operating with low activity static energy consumptions has higher impact on total energy consumption. In most cases one cannot ignore temperature influence on energy consumption.
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