17.7用于全波段连续波毫米波高光谱成像的封装90- 300ghz发射器和115- 325ghz CMOS相干接收器

T. Chi, Min-Yu Huang, Sensen Li, Hua Wang
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引用次数: 54

摘要

毫米波/太赫兹高光谱成像在安全、无损评估、材料表征和医学诊断等领域有着广泛的应用[1]。与单频成像不同,高光谱成像在宽频率范围内工作,并在每个成像像素上提供光谱信息。该系统将毫米波/太赫兹高分辨率成像与光谱学相结合,提高了检测灵敏度和特异性。实际上,基于脉冲的成像支持快速数据采集,但需要接收器(RX)具有实时宽带采样(>50GHz)。这种瞬时宽带成像模式不可避免地会出现严重的灵敏度下降(由于集成噪声),并且需要高端信号采样,这两者都使得实现低成本SoC解决方案非常具有挑战性。另一方面,连续波成像支持更好的灵敏度,特别是使用低中频带宽的相干检测方法[2-5]。它的操作允许使用一个简化的外差接收器,使整个成像系统的硅基实现。然而,目前有限的毫米波/太赫兹集成电子系统支持具有大带宽(BW)、足够输出功率(Pout)和高灵敏度的连续波高光谱成像。现有的一些连续波发射机(TX)使用谐波进行宽带覆盖,不能支持该频段内任何频率的全频段扫描[2]。本文提出了一种全波段连续波TX/RX芯片组,在不知道特定波段的情况下实现通用高光谱成像系统。因此,我们对其性能进行了优化,以在宽BW上实现平坦的TX输出和RX转换增益(CG)。我们的毫米波/太赫兹高光谱成像系统包括使用分布式四倍器架构的90至300ghz的输出变化±2dB的TX和使用基于高阶滤波器的匹配网络(MNs)的115至325ghz的四次谐波相干RX,灵敏度为- 115dBm (1kHz RBW)。TX和RX芯片是在低成本有机LCP(液晶聚合物)衬底上与宽带维瓦尔第天线集成的倒装芯片。这种封装宽带系统为低成本的现场部署高光谱成像提供了一种有前途的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
17.7 A packaged 90-to-300GHz transmitter and 115-to-325GHz coherent receiver in CMOS for full-band continuous-wave mm-wave hyperspectral imaging
Millimeter-wave/THz hyperspectral imaging has numerous applications in security, non-destructive evaluation, material characterization, and medical diagnostics [1]. Unlike single-frequency imaging, hyperspectral imaging operates over a wide frequency range and offers spectroscopic information on each imaging pixel. This combines mm-wave/THz high-resolution imaging with spectroscopy and improves detection sensitivity and specificity. In practice, pulse-based imaging supports fast data acquisition, but requires receiver (RX) with real-time wideband sampling (>50GHz). Such instantaneous broadband imaging modality inevitably exhibits severely degraded sensitivity (due to integrated noise) and requires high-end signal sampling, both of which make it very challenging to achieve a low-cost SoC solution. On the other hand, continuous-wave (CW) imaging supports better sensitivity, especially using coherent detection method with a low IF bandwidth [2–5]. Its operation allows for the use of a simplified heterodyne receiver, enabling silicon-based implementations of the entire imaging system. However, there are limited mm-wave/THz integrated electronic systems available that support CW hyperspectral imaging with a large bandwidth (BW), sufficient output power (Pout), and high sensitivity. Some existing CW transmitters (TX) use the harmonics for wideband coverage, which cannot support full-band scanning at any frequency in the band [2]. In this paper, a full-band CW TX/RX chipset is proposed to realize a generic hyperspectral imaging system without knowing the particular band of interest. We therefore optimize its performance to achieve flat TX Pout and RX conversion gain (CG) over a broad BW. Our mm-wave/THz hyperspectral imaging system comprises a 90-to-300GHz TX with a ±2dB Pout variation using a distributed quadrupler architecture and a 115-to-325GHz 4th-subharmonic coherent RX with −115dBm sensitivity (1kHz RBW) using high-order filter-based matching networks (MNs). The TX and RX chips are flip-chip integrated with wideband vivaldi antennas on low-cost organic LCP (liquid crystal polymer) substrates. This packaged wideband system offers a promising solution for low-cost field-deployable hyperspectral imaging.
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