一种干燥环境中颗粒转移和组装的粘附强度测量方法

2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Pub Date : 2012-03-05 DOI:10.1109/NEMS.2012.6196792

Shouqiang Wang, Yen‐Ting Lin, Yan-Bo Lin, Kerwin Wang

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引用次数: 0

摘要

本研究提出了一种新的非接触的方法来测量微颗粒与衬底之间的平行粘附强度。这是成本效益和节省时间。在本研究中，研究了微焊料球与PDMS(聚二甲基硅氧烷)和reproorrubber®(聚甲基氢)的粘附强度。该装置能够在每次运行中分别评估超过8个颗粒。实验结果表明，粘接强度与表面条件、零件几何形状和材料性能密切相关。试验结果还应用于连续的零件转移和装配。

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An adhesion strength measurement method for particle transfer and assembly in dry environment

This research presents a new and noncontact method to measure the adhesion strength between micro-particles and substrates in parallel. It is cost effective and time saving. In this study, the adhesion strength between micro solder ball and PDMS (polydimethylsiloxane) and ReproRubber® (polymethylhylhydrogen) are investigated. The setup is capable of evaluating more than 8 particles separately each run. The experiment results indicated that the adhesion strength is highly dependent on surface conditions, parts geometry and material properties. The testing results also have been applied to successive parts transferring and assembling.

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来源期刊

2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

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