为期一周的Euro-dots课程:微电子组件:从封装到可靠性

2013 24th EAEEIE Annual Conference (EAEEIE 2013) Pub Date : 2013-05-30 DOI:10.1109/EAEEIE.2013.6576514

H. Debéda, I. Favre, A. Gracia, N. Labat, B. Plano, H. Frémont

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引用次数: 1

摘要

“微电子组件:从封装到可靠性”课程是由波尔多大学IMS实验室提出的Euro-dots计划中的一个为期一周的课程模块，讲座由实验室说明。它得益于不同教师和研究团队的专业知识，以及技术、故障分析和表征平台。

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A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability

The course “Microelectronic assemblies: from packaging to reliability” is a one-week-course module within the Euro-dots program proposed at the IMS Laboratory, University Bordeaux, with lectures illustrated by labs. It takes benefits from expertise of different teachers and research teams and also technological, failure analysis and characterization platforms.

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2013 24th EAEEIE Annual Conference (EAEEIE 2013)

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